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3D IC and RF SiPs : advanced stacking and planar solutions...

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3D IC and RF SiPs : advanced stacking...

3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility

Horng, Tzyy-sheng Jason, Hwang, Lih-Tyng

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الفئات:

Computers - Programming

عام:

2018

الإصدار:

1st edition

الناشر:

John Wiley & Sons

اللغة:

english

ISBN 10:

111928967X

ISBN 13:

9781119289678

ملف:

PDF, 11.96 MB

IPFS:

,

english, 2018

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